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| FDM2509NZ February 2006 FDM2509NZ Monolithic Common Drain N-Channel 2.5V Specified PowerTrench MOSFET General Description This dual N-Channel MOSFET has been designed using Fairchild Semiconductor's advanced Power Trench process to optimize the RDS(ON) @ VGS = 2.5v on special MicroFET lead frame with all the drains on one side of the package. Features * 8.7 A, 20 V RDS(ON) = 18 m @ VGS = 4.5 V RDS(ON) = 24 m @ VGS = 2.5 V * ESD protection diode (note 3) * Low Profile - 0.8mm maximum - in the new package MicroFET 2x5 mm PIN 1 S1 S1 G1 G2 S2 S2 Bottom Drain Contact Q2 Applications * Li-Ion Battery Pack 4 5 6 3 G1 2 S1 1 S1 S2 S2 G2 Q1 Bottom Drain Contact MLP 2x5 Absolute Maximum Ratings Symbol VDSS VGSS ID PD TJ, TSTG TA=25oC unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage - Continuous - Pulsed Power Dissipation (Steady State) Drain Current (Note 1a) Ratings 20 12 8.7 30 2.2 0.8 -55 to +150 Units V V A W C (Note 1a) (Note 1b) Operating and Storage Junction Temperature Range Thermal Characteristics RJA RJC Thermal Resistance, Junction-to-Ambient (Note 1a) 55 2 C/W Thermal Resistance, Junction-to-Case (Drain) Package Marking and Ordering Information Device Marking 2509Z Device FDM2509NZ Reel Size 7'' Tape width 12mm Quantity 3000 units 2006 Fairchild Semiconductor Corporation FDM2509NZ Rev C2 FDM2509NZ Electrical Characteristics Symbol BVDSS BVDSS TJ IDSS IGSS VGS(th) VGS(th) TJ RDS(on) TA = 25C unless otherwise noted Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage, (Note 2) Test Conditions VGS = 0 V, ID = 250 A Min 20 Typ Max Units V Off Characteristics ID = 250 A, Referenced to 25C VDS = 16 V, VGS = 12 V, VGS = 0 V VDS = 0 V 0.6 0.9 -3 13 13.5 15.5 18 18.4 36 1200 320 f = 1.0 MHz 185 2 12 1 10 1.5 mV/C A A V mV/C m On Characteristics Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance ID = 250 A VDS = VGS, ID = 250 A, Referenced to 25 C VGS = 4.5 V, ID = 8.7 A ID = 8.5 A VGS = 4.0 V, ID = 8.1 A VGS = 3.1 V, ID = 7.6 A VGS = 2.5 V, VGS = 4.5 V, ID = 8.7 A, TJ = 125C VDS = 5 V, ID = 8.7 A VDS = 10 V, f = 1.0 MHz V GS = 50mV, V GS = 0 V, 18 19 21 24 25 gFS Ciss Coss Crss RG Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance (Note 2) S pF pF pF Dynamic Characteristics Switching Characteristics td(on) tr td(off) tf Qg Qgs Qgd IS VSD trr Qrr Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge VDD = 10 V, VGS = 4.5 V, ID = 1 A, RGEN = 6 11 15 27 12 20 27 43 22 17 ns ns ns ns nC nC nC VDS = 10 V, VGS = 4.5 V ID = 8.7 A, 12 2 4 Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward VGS = 0 V, IS = 1.8 A Voltage IF = 8.7 A, Diode Reverse Recovery Time Diode Reverse Recovery Charge dIF/dt = 100 A/s (Note 2) 0.7 20 6.4 1.8 1.2 A V nS nC Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. a) 55C/W when mounted on a 1in2 pad of 2 oz copper Scale 1 : 1 on letter size paper b) 145C/W when mounted on a minimum pad of 2 oz copper 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0% 3. The diode connected between the gate and the source serves only as protection against ESD. No gate overvoltage rating is implied. FDM2509NZ Rev C2 FDM2509NZ Typical Characteristics 30 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE VGS = 4.5V 2.5V 3.0V 2.0V 2.4 2.2 2 1.8 1.6 1.4 1.2 1 0.8 25 ID, DRAIN CURRENT (A) 20 15 10 5 0 0 3.5V VGS = 2.0V 2.5V 3.0V 3.5V 4.5V 0.25 0.5 0.75 1 1.25 1.5 0 5 10 15 20 25 30 VDS, DRAIN-SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A) Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation with Drain Current and Gate Voltage. 0.047 RDS(ON), ON-RESISTANCE (OHM) 1.6 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE ID = 8.7A VGS = 4.5V 1.4 ID = 4.4A 0.042 0.037 0.032 TA = 125oC 1.2 1 0.027 0.022 0.017 0.012 1 2 3 4 5 VGS, GATE TO SOURCE VOLTAGE (V) 0.8 TA = 25oC 0.6 -50 -25 0 25 50 75 100 o 125 150 TJ, JUNCTION TEMPERATURE ( C) Figure 3. On-Resistance Variation with Temperature. 30 25 ID, DRAIN CURRENT (A) Figure 4. On-Resistance Variation with Gate-to-Source Voltage. 100 25oC 125 C o IS, REVERSE DRAIN CURRENT (A) VDS = 5V TA = -55oC 10 1 VGS = 0V 20 15 10 5 0 0.5 1 1.5 2 2.5 VGS, GATE TO SOURCE VOLTAGE (V) TA = 125oC 0.1 0.01 0.001 0.0001 0 0.2 0.4 0.6 0.8 1 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) 25oC -55oC Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature. FDM2509NZ Rev C2 FDM2509NZ Typical Characteristics 5 VGS, GATE-SOURCE VOLTAGE (V) 1800 ID = 8.7A 4 VDS = 5V CAPACITANCE (pF) 1600 f = 1MHz VGS = 0 V Ciss 10V 15V 1400 1200 1000 800 600 400 200 3 2 Coss 1 Crss 0 4 8 12 16 20 0 0 3 6 9 12 15 Qg, GATE CHARGE (nC) 0 VDS, DRAIN TO SOURCE VOLTAGE (V) Figure 7. Gate Charge Characteristics. 100 P(pk), PEAK TRANSIENT POWER (W) Figure 8. Capacitance Characteristics. 50 RDS(ON) LIMIT ID, DRAIN CURRENT (A) 100us 1ms 10ms 100ms 1s 10s DC 10 40 SINGLE PULSE RJA = 145C/W TA = 25C 30 1 VGS = 4.5V SINGLE PULSE RJA = 145oC/W TA = 25oC 0.01 0.1 1 20 0.1 10 10 100 0 0.001 0.01 0.1 1 t1, TIME (sec) 10 100 1000 VDS, DRAIN-SOURCE VOLTAGE (V) Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum Power Dissipation. r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 1 D = 0.5 RJA(t) = r(t) * RJA RJA =145 C/W P(pk) t1 t2 TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2 SINGLE PULSE 0.2 0.1 0.1 0.05 0.02 0.01 0.01 0.0001 0.001 0.01 0.1 t1, TIME (sec) 1 10 100 1000 Figure 11. Transient Thermal Response Curve. Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDM2509NZ Rev C2 FDM2509NZ Dimensional Outline and Pad Layout FDM2509NZ Rev C2 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST(R) ActiveArrayTM FASTrTM BottomlessTM FPSTM Build it NowTM FRFETTM CoolFETTM GlobalOptoisolatorTM CROSSVOLTTM GTOTM DOMETM HiSeCTM EcoSPARKTM I2CTM E2CMOSTM i-LoTM EnSignaTM ImpliedDisconnectTM FACTTM IntelliMAXTM FACT Quiet SeriesTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM DISCLAIMER ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I18 |
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